ELECTROPLATING CHEMICALS · EGYPT
Acid Copper Plating Additives
Process additives for bright, levelled acid copper deposits with technical support for bath control.
Product and support scope
- Brightener and carrier systems
- Levelling and wetting additives
- Bath make-up support
- Defect diagnosis and Hull Cell trials
Information needed for a recommendation
Send the base metal, existing bath chemistry, bath volume, production method, required finish and the current operating issue. Final product selection and operating values depend on the installed system and verified bath analysis.
Technical note: Product selection and additions should follow the relevant data sheet, bath analysis and site safety procedures.